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70567-0009 - 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, Tin (Sn) Plating

70567-0009_4885068.PDF Datasheet


Part No.	70567-0009 0015800221
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, Tin (Sn) Plating
File Size	1,218.41K / 7 Page
Maker	Molex Electronics Ltd.
Homepage	http://www.molex.com/
Download	[ 70567-0009 0015800221 Datasheet PDF Downlaod from IC-ON-LINE.CN ] [ 70567-0009 0015800221 Datasheet PDF Downlaod from Datasheet.HK ] [70567-0009 0015800221 Datasheet PDF Downlaod from Maxim4U.com ] :-) [ View it Online ] [ Search more for 70567-0009 ] [ Price & Availability of 70567-0009 by FindChips.com ]

Full text search : 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, Tin (Sn) Plating

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